a techfocus media publication :: March 27, 2007 :: volume VI, no. 12

FROM THE EDITOR

Has convergence caught you with your batteries down and your BOM rising? With today’s crush to differentiate mobile devices with piles of features, system designers are stuck between marketing optimism and engineering reality as they try to balance cost, power, and all those peripherals bolted to their embedded processors. QuickLogic has just introduced ArcticLink – a new chip family designed to handle the multiplicity of connections required in mobile embedded systems. Our latest feature takes a look.

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Kevin Morris – Editor
Embedded Technology Journal

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CURRENT FEATURE ARTICLES

ArcticLink
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JOURNAL WEBCASTS

(NEW!)Using Processors in FPGAs? The industry's only soft IP ARM7 core for Flash FPGAs sponsored by Actel

Low Power FPGA design with Actel IGLOO, the 5µW FPGA for cool portables sponsored by Actel

ARM7, Analog,Flash and FPGA in a Single Chip Actel's ARM in Fusion sponsored by Actel

Introducing Actel Fusion – the world’s first Flash-based FPGA, with Memory and Analog front end sponsored by Actel

Introducing Spartan-3AN FPGAs – Non-Volatile Secure Platform for Highest System Integration sponsored by Xilinx

Embedded Design with LatticeMico32 Open, Free 32-bit Soft Processor sponsored by Lattice Semiconductor


Speed Adoption of Intel® Multi-Core Processors with VirtualLogix Real-Time VirtualizationTechnology sponsored by VirtualLogix

ArcticLink
Connectivity Without the Watts

You’re designing a new handheld device. You’ve got your processor picked, your software platform selected, your debugger dialed-in, and your battery bolted into place. Marketing has signed off on the baddest list of requirements ever – convergence has taken a turn for the terrible, and your device has to connect to ubiquitous wireless standards, seven kinds of mass storage, USB2.0, SDIO, and even PCI (Don’t ask why you’d need all of those – this is a fictional project, OK? Suspend disbelief for a moment.) The point is, you need a way to hook all that stuff into your system without burning your battery reserves just keeping everything connected.

QuickLogic’s new ArcticLink was created just for you. ArcticLink is a new device that acts as super-low-power digital duct tape, stitching together the various components of your system and providing a level of flexibility through its programmable fabric that will let marketing change its mind repeatedly without bombing your BOM too badly. The playing field in the handheld market changes almost daily, and differentiating your product is a balancing act weighing the benefits of differentiating features against the evils of increased time-to-market, BOM cost, power consumption and form factor. [more]


LATEST NEWS

March 27, 2007

RTI delivers low latency with scalability to accommodate exploding data volumes

Atmel Launches LF RF IDIC With Unique ID and Unsurpassed Read/Write Performance

VMETRO ships AES-256 Data Encryption Recording System

Innovative Silicon’s Z-RAM® Ultra-Dense Memory Now Backed by 21 Patents

Avnet Electronics Marketing to Exhibit at CMP Media's Embedded Systems Conference Silicon Valley

VaST to Demonstrate Virtual System Prototyping Solutions at the Embedded Systems Conference Silicon Valley

Freescale Launches Single-Chip ZigBee® Platform in Package™ Solution

Microtune Reference Design Gives OEMs Cost, Performance and Time-to-Market Advantage in Building DVB-C Set-Top Boxes

Dekolink Announces 1900 MHz Band Selective RF Compact Repeater which Supports up to Four Non-Contiguous Frequency Blocks

Skyworks Launches Helios™ 3 – Smallest and Most Efficient Polar Loop™ EDGE RF Subsystem with DigRF Interface

Airbee Wireless to Demonstrate Low-Power Mesh Networking Technology and Facilitate Hands-on Training Session at ZigBee Developers Conference

Oki Semiconductor Announces the Release of ZigBee 2006 Certified Development Platforms

Micrium Introduces Industry’s First Universal Embedded System Monitoring Tool

March 26, 2007

AMCC Showcases a Complete Portfolio of SFP+ PHYs at OFC 2007

Virage Logic and Tower Semiconductor Agreement Provides Mainstream NVM Availability for RF and Mixed-Signal Applications

AMCC Announces New Suite of SONET/SDH/10GE PHY Chips at OFC

 

March 26, 2007 continued

ANTs Granted U.S. Patent for Core, Lock-Free Database Technology

Virtutech to Present Two Sessions on Virtualized Software Development at Multicore Expo 2007

Xilinx Simplifies Embedded Development With New EDK 9.1i Suite

Mentor Graphics Announces Subsystem Intellectual Property Launch with First Delivery of Integrated USB Solution

New Mellanox ConnectX IB Adapters Unleash Multi-core Processor Performance

March 23, 2007

Mistral announces arrival of new StorBank-XL™ 40t from DNF Storage

Lyrtech Launches Quad Dual-Band RF Transceiver

PFU Systems Introduces Off-the-Shelf COM Express Carrier Board

March 22, 2007

NextComputing offers NVIDIA Quadro® FX 4600 by PNY Technologies® graphics board on NextDimension family of portable, flextop computers

Mantaro Networks Joins Nallatech’s Channel Partner Program

Xilinx is Processing at ESC Silicon Valley 2007

March 21, 2007

ESLX Joins VaST’s Galaxy Network of SystemC Services Providers

Power Architecture™ Developer Conference Call For Papers: ''Breaking Down Barriers to Innovation''

Denali Announces Webcast Series Addressing Intel's NAND, NOR, and Phase Change Memory

International Basestation Conference Tackles Femtocells, LTE Business Models, Mobile TV Standards, All-IP Networks and WiMAX Realities

 


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