a techfocus media publication :: August 29, 2006 :: volume IV, no. 09

FROM THE EDITOR

As engineers, we're always working to improve our process - to simplify design and make new product development faster and easier. Did you ever wonder what would happen if we succeeded? Completely? This week's new editorial feature takes a look at the commoditization of engineering itself, and speculates on the likely outcome.

Our second new feature is a contributed article that examines new advances in ceramic packaging technology. While ceramics have historically been an exotic and somewhat specialized high-performance technology, new advances are making them a realistic option for mainstream design.

Our Journal Jobs website is sporting new features, new jobs, and a host of new opportunities for employers and job seekers alike.  If you haven't visited www.journaljobs.com lately, stop by and see what's cooking in the world of technology employment.

Thanks for reading! If there's anything we can do to make our publications more useful to you, please let us know at: comments@embeddedtechjournal.com

Kevin Morris – Editor
Embedded Technology Journal

ANNOUNCEMENTS

Nallatech – The World Leader in FPGA Computing Solutions is recruiting now.
Nallatech is the world’s leading supplier of high-performance COTS FPGA Solutions. Nallatech designs and manufactures high-performance FPGA embedded products for the Defense and Security Market. We are currently recruiting Hardware Engineers in our UK locations.
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CURRENT FEATURE ARTICLES

System Design by Swarm
Natural Selection in Embedded Design

Ceramic Injection Molding Produces Complex Parts With Tight Tolerances
by Paul Manison, Morgan Advanced Ceramics
A Mile in Their Shoes
Altium’s Engineering Empathy
ESL for FPGAs
Tools Make FPGA Design an Exercise in Software Programming
by Milan Saini, Xilinx Inc.
MIPS for your Media Room
MIPS/Dolby Team to Accelerate Audio Deployment
Forgotten Battles
Holes in the Engineering Fossil Record
Wind River Zooms In
Increased Focus on Consumer and Networking

JOURNAL WEBCASTS

UPCOMING:

"Optimizing Verilog Coding for More Efficient FPGA Synthesis" sponsored by Lattice Semiconductor
Date: Tuesday, September 19, 2006
Time: 11 a.m. Pacific / 2 p.m. Eastern
Click to register

ON DEMAND:

"Designing 2Gbps Parallel I/O with the LatticeSC FPGA" sponsored by Lattice Semiconductor

Click here to watch!

Lattice's new 90nm LatticeSC family--general introduction, sponsored by Lattice Semiconductor.

Click here to watch!

System Design by Swarm
Natural Selection in Embedded Design

The advent of the programmable embedded platform has created a revolution in electronic hardware design. Before high-performance embedded computers, most features of any product had to be custom designed in physical hardware. This fact slowed technology progress, creating a barrier to entry into any worthwhile market and protecting the position and investment of those who had developed working systems.

Once the embedded computer came on the scene, however, the game changed rapidly. Because most product-specific features could now be implemented in hardware, the physical difference between products began to diminish. Block diagrams of almost every type of product from mobile phones to GPS receivers to digital cameras to high-end washing machines started to look surprisingly similar. In today’s typical system, there’s a processor or two, a few peripherals, the least memory we can get away with, and a bus or switch fabric stitching it all together. The secret sauce is no longer contained in the physical part of the system, but instead, in the embedded device software that makes it all go. [more]


Ceramic Injection Molding Produces Complex Parts With Tight Tolerances
by Paul Manison, Morgan Advanced Ceramics

Recent advances in ceramic injection molding (CIM) make it technically feasible and economical to produce medium to large volumes of complex, ultra-high precision ceramic components. Engineers can now combine the intricate geometry, which has long been the domain of plastic and metal parts, with the superior performance characteristics of ceramics.

The well-known benefits of ceramic material include: high hardness and mechanical strength; wear and corrosion resistance; dimensional stability over a wide range of temperatures; ability to withstand high working temperatures; good electrical insulation and excellent dielectric properties. However, until recent advances in CIM technology, production engineers and product designers did not view ceramics as a viable option for complex parts requiring tight dimensional tolerances. [more]

LATEST NEWS

August 29, 2006

Discover How Altera's Programmable Solutions Drive Innovation in the Broadcast Industry at IBC2006

Mercury Computer Systems Announces the Highest Performing Conduction-Cooled COTS Computer System

ATEME to Showcase Its MPEG-4 AVC / H.264 Encoding Solutions at IBC 2006

Sprint Launches First EV-DO Revision A-Capable Mobile Broadband Card in the Nation; Card to Support Advanced Mobile Broadband Speeds When Available in 4Q 2006; Total Mobile Broadband Footprint to Cover 200 Million People by Year End

SYSPRO Releases New, Ground-Breaking Version of SYSPRO ERP Software

IBM, Chartered, Infineon and Samsung Announce Process and Design Readiness for Silicon Circuits on 45nm Low-Power Technology

Unicoi Systems Releases WebPilot Embedded Web Browser v8.1; Release Includes the Powerful Fusion GUI Toolkit v6.0

August 28, 2006

Avnet Technology Solutions and DSI Team to Provide Integrated Wireless Data Capture Solution; Offering Includes Software, Server, Wireless Hardware and Services for Barcode and RFID Technology Solutions

Avnet Technology Solutions Launches IBM Training Portal

Dongbu Electronics Completes Development of Optical Proximity Correction (OPC) Tool for 90nm Wafers

Juniper Networks Offers Best-in-Class Unified Threat Management With Enhanced Firewall/VPN

August 28, 2006 (continued)

MD Nastran(TM) Demonstrates Record 64-bit Speed and Performance Benchmark Results on Dual-Core Intel(R) Xeon(R) Processors

RTI Teams with Concurrent to Support U.S. Navy's Aegis Open Architecture Program

Boeing Selects Aonix ObjectAda for Tomahawk Cruise Missile Mission Planning Software

August 25, 2006

Mistral premiers Upgraded Version of Targa's Removable Disk with an increased capacity of 64 GB

August 24, 2006

Xceive Announces Low Power, High Performance Single-Chip RF-to-Baseband Receivers; Fully Integrated Silicon Tuners Provide 20 Percent Power Savings for Portable LCD-TVs, USB TV Sticks, and Notebook Applications

Nuance Communications Teams with Analog Devices to Offer Advanced Automotive Platform; Nuance Speech Applications on Blackfin Platform Power Hands-free Solutions for Leading Automotive Suppliers

August 23, 2006

Capricorn Technologies Redefines the Economics of Storage; Leading Provider of Low-Cost, Power Efficient Data Storage Solutions Introduces 3TB and 120TB Platforms With Exceptional TCO

Independent Benchmark Scores Show Freescale's Industry Leading MSC8144 DSP Soars against the Competition; Freescale Device is Top Performer among Fully Programmable DSPs Tested by BDT


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