a techfocus media publication :: January 31, 2006 :: volume II, no. 03

FROM THE EDITOR

This is the last week of our reader survey for new features we’re contemplating for Embedded Technology Journal. If you haven’t filled it out already, please click here to give us your thoughts. We want to be sure our new stuff is top-notch, and your opinion will help us get there. It just takes a minute.

Our latest feature looks at software development tools for embedded designers. While it isn’t imperative that you customize your tool bench for embedded development, it turns out to be a really good idea. We examine the specialized requirements of the embedded developer, and some of the tools that address them.

Our second article comes from Bryon Moyer at Teja Technologies, and looks at packet processing with multi-core FPGAs. Software acceleration in hardware can kick up packet processing performance to new levels much like in the more familiar DSP domain.

Thanks for reading! If there's anything we can do to make our publications more useful to you, please let us know at: comments@embeddedtechjournal.com

Kevin Morris – Editor
Embedded Technology Journal


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CURRENT FEATURE ARTICLES

Tricking out Your Toolbox
Tooling up for Embedded Software Development
Taming Embedded Multi-Core on FPGAs for Packet Processing
by Bryon Moyer, Teja Technologies, Inc.
This Engineer Walks Into a Bar…
Debunking the Nerd Myth
Getting Performance with Memory Protection in Real-time Windows Systems
by Rick Knowles, Ardence, Inc.
Beverly Hills 802.16
WiMAX, You da MAN
The Challenges of an Embedded Software Engineer Part 2: Decisions, Decisions
by Madison Turner, Accelerated Technology, a Mentor Graphics Division


Tricking out Your Toolbox
Tooling up for Embedded Software Development

The duct tape kept sticking to the hairs on my hand. Every time I tried to turn the wrench, it would adhere and tear at the skin, sending pain up my freshly burned arm (hint: let the engine cool before attempting to remove a major component), which was jammed between the front of the alternator and a frame cross-member. A bolt I had misplaced earlier made its presence known as I inadvertently slid over it on my back, causing it to gouge through my work shirt, poking my shoulder. WD-40 dripped down the front of the engine onto my work goggles, almost running up my nose, and I struggled to move out of the way.

I had been trying unsuccessfully to coax the same screw from its socket for over an hour with my makeshift apparatus consisting of a screwdriver bit, a crescent wrench, some duct tape, and a chunk of wood. I finally gave up. An hour later, I returned from the parts store with the correct angle screwdriver, a ramp to lift the front of the car, and some wheel chocks. Thirty seconds after that, the offending screw was in my hand. Sometimes, having the right tools for the job makes an enormous difference. [more]

Taming Embedded Multi-Core on FPGAs for Packet Processing
by Bryon Moyer, Teja Technologies, Inc.

In public discussions about embedded multi-processing and FPGAs, most of the focus has been on DSP. But there’s another application area requiring embedded multi-processing that has remained elusive, not because of silicon deficiencies, but due to the lack of an easy methodology. That application is packet processing. Packet processing performance as high as 10 Gbps is possible in FPGAs, so the silicon is fast, but even single gigabit performance has required RTL and a hardware approach to design.

Many companies with projects involving packet processing work exclusively in software, predominantly C. They have infrastructures and methodologies based around software. They have hardware groups that provide them with the boards and systems they need, but see the bulk of their value in software. These companies do not want to learn RTL or use a hardware design approach; they want to work in C using a software approach. As a result, they have not included FPGAs in their consideration of packet processors. [more]

LATEST NEWS

January 31, 2006

Virtual Instrumentation Delivers 10X Increase in Efficiency Over Traditional Methods for Power Monitoring; Texas Instruments Power Optimization DSP Starter Kit Delivers Power Monitoring Based on NI LabVIEW Software and USB Hardware

Objective Interface and Interpeak Collaborate to Increase Performance of Embedded Systems on a Network; Industry Leaders Offer Integrated Communications Middleware-Networking Solution for Embedded Applications, IPv6 Compatibility also Announced

Hypertronics Announces Custom Interconnect for Medical Disposable Electronic Probes; Complete Invasive Electronic Probe Interconnect Solution Accelerates Design Lead-Time

MQX Embedded Announces MQX(TM) RTOS Availability for New Freescale Semiconductor ColdFire(R) MCF532x and MCF537x Processors

Freescale Technology at the Heart of 3G and Seamless Mobility Innovations; From 3G, HSDPA and DVB-H to UWB, ZigBee(TM) and WiMAX: Freescale Showcases Cutting-Edge Wireless Technologies at 3GSM World Congress

Green Hills Software Announces DSO Solution for Xilinx Virtex-4 Platform FPGAs; Immediate Availability of Leading Hardware and Software Solution for Software Defined Radio (SDR)

LSI Logic Joins Synplicity Partners in Prototyping Program

Xilinx Announces Advanced Reference Designs to Accelerate Design of Flat-Panel Displays

Xilinx Delivers Industry's First 667 Mbps DDR2 SDRAM Interface Solution

January 30, 2006

Freescale Introduces First 5-volt Capable Family of 8-bit HCS08 Microcontrollers; MC9S08AW Family is the First HCS08 Fully Qualified for the Automotive Market

SIPquest Mobile Console Optimized for Microsoft Windows Mobile 5.0 Dual-Mode Devices (CDMA & WiFi and GSM & WiFi); First Mobile VoiP Application Optimized for Smartphones and PDAs
3GSM World Congress 2006

6WIND Announces Support for Cavium Networks Octeon(TM) Multi-Core Mips64(R) Based Processors

Mocana Receives FIPS 140-2 Certification for Robust Crypto Module; Mocana's Embedded Security Suite Crypto Module Achieves the Highest Level Available for a Software Only Solution

January 30, 2006 (continued)

Freescale Creates First Commercially Viable GaAs MOSFET Device; Breakthrough Could Mean Dramatic Performance Gains for a Broad Range of End Applications

Renesas Technology Releases 600MHz SH7785 Superscalar 32-bit Microprocessor for Car Infotainment Systems and Other High-Performance Multimedia Applications

Pulse Introduces SMART Series of xDSL Integrated Splitter/Filter Modules; Fully Tested Electrical Modules Meet All International Standards for Worldwide Applications

TimeSys Introduces LinuxLink Subscriptions for the MIPS32(R) 24KE(TM) Core Family; Continuously-Updated Embedded Linux Resource Accelerates SoC Development

Rio Design Automation Unveils First Commercially Available Package-Aware Chip Design Software; RioMagic's Interconnect Synthesis Approach for Early Chip Floorplanning Positively Impacts Final Cost, Performance of Finished Product

Silistix Self-Timed Interconnect Solution Supports AMBA Bus Protocol

Actel Flash FPGA Provides Heart of Integrated Railway Communications Products

ARM Announces New RealView Development Tools for ARM Powered Microcontrollers

January 26, 2006

Denali Delivers Simulation Models for Micron's NAND Flash Devices

January 25, 2006

QuickLogic Ultra Low-Power Eclipse II FPGAs Available in 8x8 mm Ball Grid Array Package

EVE to Exhibit at Electronic Design and Solution (EDS) Fair; Will Demonstrate Hardware-Assisted Verification January 26-27 in Yokohama, Japan

ARM-Synopsys Verification Methodology Manual for SystemVerilog Endorsed by Leading Japanese Semiconductor Companies

ARM Processor and Physical IP Deliver Groundbreaking 750 MHz ARM11 Implementation


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