a techfocus media publication :: November 22, 2005 :: volume I, no. 08

FROM THE EDITOR

This week, we’re back from Supercomputing 2005 in Seattle with a report on the simultaneous state of the highest and lowest-end computing – supercomputers and embedded systems. Interestingly, the two have more in common with each other than with the middle members of the computing family, and the dual domains collide with extremely interesting results in the super-specialized realm of high-performance embedded computing (HPEC).

If you haven’t checked out our new Journal Jobs employment site (www.journaljobs.com) it’s worth a visit. New jobs are being posted regularly, and traffic is skyrocketing since we upgraded the site.  Registration is free, and it’s a great place to start looking for that next promotion.

Thanks for reading! If there's anything we can do to make our publications more useful to you, please let us know at: comments@embeddedtechjournal.com

Kevin Morris – Editor
Embedded Technology Journal


ANNOUNCEMENTS

Better performance, faster time to market.
Rambus interface solutions power today's best-of-breed consumer electronics, computing, and communications products. At 6.4 GHz, Rambus' XDR DRAM is the world's fastest memory solution. With Rambus interfaces having shipped in over 500 million chips, Rambus' high-performance, production-proven technology is your license to speed.

Click here for more info!


FIND A BETTER JOB. Browse new JOURNAL JOBS section from Embedded Technology Journal to find challenging and rewarding opportunities with the embedded technology industry’s top companies. Journal Jobs is specifically for embedded technology professionals – more of what you’re looking for, less of what you’re not.
Browse now!


FPGA AND STRUCTURED ASIC JOURNAL
A weekly e-mail newsletter from techfocus media (publishers of Embedded Technology Journal) dedicated to the design and application of FPGA and structured ASIC technology.
SUBSCRIBE NOW - FREE!

CURRENT FEATURE ARTICLES

Supercomputing To Go
HPEC Raises its Head at SC|05

Changing Waves
Moving from Moore to Multi-core
RTOS Roundup
Ambiguity Abounds in Device Software
Chillin’ with QuickLogic
PolarPro Brings FPGAs to BatteryLand
The Case for Hardware/Software Co-Verification
Can’t I Do That With a Development Board?
by Ross Nelson, Mentor Graphics Corporation
Tyranny of the Metaphor
The Slippery Slope of Scheduling Software
ARMed and Dangerous
Actel/ARM Tackle Embedded Applications
Baby, You Can Drive My Car
Embedded Systems Fuel Automotive Innovations


Supercomputing To Go
HPEC Raises its Head at SC|05

Most of us think of embedded computers as smaller, slower, more efficient cousins of conventional, commodity, general-purpose computing hardware. Since most embedded systems designers are trying to cram capable computers into tiny form-factors with miserly power budgets, we find ways to compromise on capabilities like available memory, I/O bandwidth, processor speed, and software robustness. We cut down our expectations so we can squeeze into handhelds and mobile platforms, content with delivering our computing power directly where it’s needed instead of inside a desktop box or briefcase.

Some embedded applications are much tougher, however. There are cases when we need to deliver copious amounts of computing power while remaining off the grid. Last week, at Supercomputing 2005 in Seattle, there was ample evidence of just such compute power gone mad. Gigantic racks of powerful processors pumped piles of data through blazing fast networks and onto enormous storage farms. The feel of the place was about as far from “embedded” as you can get, unless your idea of embedding somehow involves giant air-conditioners and 3-phase power.

Behind the huge storage clouds, teraflop racks, and nation-sized networks, there was considerable embedded computing activity going on, however. Although not its main event, high-performance embedded computing (HPEC) was hanging out at the show and getting a good deal of quiet attention. It seems that not all of life’s difficult problems will hold still long enough for you to ship them off to a supercomputer facility. Sometimes, massive processing power is required to interpret images in real-time, process radio signals on the fly, or solve complicated algorithms from inside a moving vehicle. It’s those applications that put the “E” in HPEC, and several forward-thinking companies were at the show, working to help the rest of us see the light.

To briefly trace the history of embedded systems architectures, we have moved rapidly from systems-in-chassis to systems-on-board, then into system-on-chip (SoC) integration over the past decade. Each time we’ve integrated, our power density has increased as our form factors shrank. Interestingly, today, embedded systems have more in common with supercomputers than with commodity desktop and laptop machines. As we highlighted last week in “Changing Waves,” both supercomputers and embedded computers have hit the wall of diminishing returns on single-thread, Von Neumann processors and have moved into the domain of multi-core and alternative architecture processing. [more]

Visit Techfocus Media

LATEST NEWS

November 22, 2005

National Instruments Introduces New Line of HMIs for LabVIEW

Atmel Launches BCDMOS Fail-Safe System IC ATA6814 Designed for Safety-Critical Automotive Applications

November 21, 2005

Stretch Selects SlickEdit Technology

-40 Degrees to +85 Degrees C CompactFlash Provides High Endurance and Wide Operating Temperature for Industrial Applications

Spansion Introduces High-Density 64 Mb Serial Flash Memory Device; MirrorBit Technology Enables Continued Expansion into Low-Cost Serial Flash Memory Market

Atmel Launches Highly Integrated RoHS-compliant SiGe Front-End IC for Private Mobile Radios (PMR)

November 17, 2005

The MathWorks and AspenTech Collaborate to Deliver Link between Simulink and Aspen Dynamics

Xilinx Sets Up Authorized Training Provider Network to Accelerate the Growth of the PLD Market in Asia Pacific

November 16, 2005

LTX Introduces Fusion MX - the New Mixed Signal Cost of Test Benchmark; Optimal Performance and Price for Wireless, Power, Datacomm and Automotive Devices

M-Systems and Infineon Sign Supply Agreement for Mobile-RAM; Infineon Mobile-RAM will be used for DiskOnChip(R)-based Multi-Chip Package Products for Mobile Handsets

Freescale ColdFire(R) Microprocessors Enable High Performance Human-Machine Interface for Industrial Markets

Tarari Announces RAX-XSLT: World's First Silicon-or-Software XSLT Engine; Two New XSLT Engines -- One Silicon-Based and One ``Pure Software'' -- Extend Tarari's Leadership in XML Content Processors for Networking, Appliance, and Server OEMs


You're receiving this newsletter because you subscribed at our web site www.embeddedtechjournal.com.
If someone forwarded this newsletter to you and you'd like to receive your own free subscription, go to: www.embeddedtechjournal.com/update.
If at any time, you would like to unsubscribe, click here. (But we hope you don't.)
If you have any questions or comments, send them to comments@embeddedtechjournal.com.

All material copyright © 2003-2005 techfocus media, inc. All rights reserved.
Privacy Statement