GE Fanuc Intelligent Platforms Announces Telum™ 210 SAS AdvancedMC™ Module

High performance, high availability mass storage for MicroTCA™, AdvancedTCA® environments

* Serial-attached SCSI (SAS) 10,000rpm 73 GBytes/146 GBytes
* Onboard LSI 1064E SAS/SATA 3 Gbits/second controller
* Hot swap capable
* Estimated 1,400,000 hours MTBF

CHARLOTTESVILLE, Va.--(BUSINESS WIRE)--Demonstrating once more the company’s commitment to providing a complete portfolio of state-of-the-art solutions for the AdvancedTCA® and MicroTCA™ market, GE Fanuc Intelligent Platforms today announced the Telum™ 210 SAS AdvancedMC™ module. The Telum 210 provides a reliable, scalable, high performance solution for critical applications that demand leading edge system storage capabilities including blade servers, network and telephony routers, and video streaming or surveillance through an onboard 73 GBytes or 146 GBytes serial-attached 10,000rpm SCSI (SAS) hard disk drive with an LSI 1064E SAS/SATA 3 Gbits/second controller.

“As customers realize the potential of AdvancedMC and MicroTCA platforms, they are uncovering enterprise class applications for which those platforms are ideally suited,” said Mack Bennett, Product Manager for Commercial I/O at GE Fanuc Intelligent Platforms. “In turn, that has created a requirement for compact, open standards-based mass storage subsystems capable of delivering high throughput while maintaining maximum uptime. The Telum 210 is our response to that requirement, and reinforces our determination to be the leading supplier of the building blocks that enable world class MicroTCA solutions.”

The LSI 1064E controller supports PCI Express Hot-Plug control, making the Telum 210 hot swap capable and field replaceable in accordance with the AMC.0 R2.0 standard. The Telum 210, which has an estimated MTBF of 1.4 million hours, supports single- and dual port SAS drives, and also supports RAID with integrated striping and mirroring firmware (no software support required).

By combining the controller and hard disk drive on a single AdvancedMC module, the Telum 210 is highly space-efficient - allowing optimum use of the chassis - while freeing host processor resources. The AMC.1 PCI Express™ implementation provides greater bus bandwidth by providing eight PCI Express lanes at a transfer rate up to 2.5Gbits/second per lane, full duplex. Four AMC.1- and AMC.3 compliant SAS channels are provided, with support for up to two off-board channels. For maximum system design flexibility, the module is available with either a mid-size or full-size faceplate. Conformal coating is optional.

The Telum 210 provides support for Solaris™, Linux®, Windows® 2000 and Windows XP.

About GE Fanuc Intelligent Platforms

GE Fanuc Intelligent Platforms, a joint venture between General Electric (NYSE: GE) and FANUC LTD of Japan, is a high-performance technology company and a global provider of hardware, software, services, expertise and experience in automation and embedded computing, with products employed in virtually every industry, including manufacturing automation, defense, automotive, telecommunications, healthcare and aerospace. GE Fanuc Intelligent Platforms is a worldwide company head-quartered in Charlottesville, VA, and is part of GE Enterprise Solutions. For more information, visit www.gefanuc.com

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