Source: NXP
February 25, 2008

NXP announces world’s smallest high-performance MOSFET

SOT883 MOSFETs deliver smaller, slimmer, faster, green technology for portable devices

February 25, 2008 – Austin, Texas – NXP Semiconductors, the independent company founded by Philips, today announced a new range of small signal MOSFET devices housed in one of the world’s smallest packages, the SOT883. Boasting an ultra-small 1.0 x 0.6 mm footprint, NXP’s SOT883 MOSFETs deliver power dissipation and performance comparable to SOT23, while occupying only 14 percent of the printed circuit board space. Designed for use in a broad range of applications including DC/DC converter modules, power supplies for LCD TV and load switching for cellular phones and other portable devices, the SOT883 MOSFETs’ ultra-small footprint, extremely low 0.5 mm profile and best-in-class switching speed and very low Rds(on) enable manufacturers to meet consumer demand for more compact and power-efficient products.

“Market demands for smaller portable devices with increased battery life are driving the race to fit sophisticated functionality into smaller and smaller form factors,” said Dean Montano, product marketing manager, NXP Semiconductors. “Built on NXP’s proven Quad Flat Non-leaded technology, the SOT883 MOSFETs offer customers a power efficient and environmentally friendly package that still delivers the performance required by today’s cellular phone and mobile computing applications.”

In addition to dramatically reducing the MOSFETs’ footprint, NXP has eliminated the leads, which both frees up additional board space and improves thermal performance. This combination of superior thermal performance and Rds(on) values of less than 0.65 ohms at 2.5 V allows NXP’s newest MOSFETs to offer higher current carry capacity than currently available 1.0 x 0.6 mm MOSFETs. The new series also features best in class switching speed, with turn on times between 12-16 ns and turn-off times between 17-24 ns.

Manufactured using pure tin plating, high-efficiency packing techniques and green plastics that dispense with toxic flame retardants, the SOT883 MOSFET devices meet all environmental protection targets. The high packing density also fits 10,000 devices on a standard 180 mm reel, thus lowering assembly costs and inventory requirements.

The SOT883 is just one package offered by NXP in a portfolio of over 50 space-saving leadless packages with between two and 24 pins and dimensions ranging from 1.0 x 0.6 x 0.4 mm to 5.0 x 6.0 x 0.85 mm. These packages maximize the active silicon on the circuit board and minimize the use of raw materials to reduce costs. NXP offers the industry’s broadest portfolio of multimarket semiconductors in leadless packages.

Product Types

The following product types are now available in the SOT883 package from NXP:

PMZ760SN

PMZ390UN

PMZ250UN

PMZ270XN

PMZ350XN

Pricing and Availability

Pricing starts at US $0.20 for delivery in quantities of 10K MOQ. For larger orders, please contact a local sales representative for volume pricing. NXP will offer demonstrations of its SOT883 MOSFET devices at APEC 2008, booth #435/437/534/536. Samples are available now with production quantities subject to lead times of 12 weeks or more. Additional information is available at http://www.nxp.com/acrobat_download/literature/9397/75016258.pdf

About NXP Semiconductors
NXP is a top 10 semiconductor company founded by Philips more than 50 years ago. Headquartered in Europe, the company has 37,000 employees working in more than 20 countries and posted sales of EUR 5 billion in 2006. NXP creates semiconductors, system solutions and software that deliver better sensory experiences in mobile phones, personal media players, TVs, set-top boxes, identification applications, cars and a wide range of other electronic devices. News from NXP is located at www.nxp.com