Freescale Selects 200mm SUSS Tool Set for MEMS Facility

MUNICH, Germany--(BUSINESS WIRE)--SUSS MicroTec (FWB:SMH) (GER:SMH), a leading supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced today it has shipped and successfully installed several microelectromechanical systems (MEMS) production tools at Freescale Semiconductor. The equipment included a new DSM200 Series Front-to-Back Alignment Verification System, the latest generation SUSS MA200Compact Mask Aligner as well as a SUSS ABC200 series Wafer Bond Cluster system for use in MEMS sensor applications.

With shrinking design rules, MEMS devices must be produced with higher precision and accuracy to ensure reliability and the required performance. With an accuracy of 0.2 micron at 3 sigma, the DSM system demonstrates excellent measurement results in automated mode. Working in concert with the SUSS Compact series mask aligner, these two machines represent the perfect package for double-sided alignment and exposure applications frequently used in the manufacturing of MEMS, power semiconductors and optoelectronic devices.

“Front-to-Backside alignment verification is an important metric for Freescale for cost-effective mass production of MEMS devices,” said Satoru Matsumoto, vice president, Fab Operations, Freescale Semiconductor. “The ability of the DSM system to provide outstanding process control at an early stage of the process can help produce a higher overall yield. We chose SUSS MicroTec because it offers effective lithographic and wafer bonding solutions for MEMS applications as part of a competitive package."

The Wafer Bond Cluster with unsurpassed post bond alignment accuracy is especially designed to meet the stringent requirements for advanced MEMS sensor production.

Freescale first purchased and installed the equipment in its 150mm Sendai Fab. Based on Sendai’s successful experience, Freescale purchased additional tools for its 200mm MEMS production line at its Oak Hill Fab in Austin, Texas.

“We are very honored that Freescale has chosen SUSS lithography and bonding systems for its MEMS production. SUSS is excited to contribute to the remarkable progress that is currently being made in this market. This order further solidifies SUSS' position as the leading supplier of production MEMS equipment.” added Rolf Wolf, General Manager, SUSS MicroTec’s Lithography division.

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information, please visit http://www.suss.com

About Freescale Semiconductor

Freescale Semiconductor is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial, networking and wireless markets. The privately held company is based in Austin, Texas, and has design, research and development, manufacturing or sales operations in more than 30 countries. Freescale is one of the world's largest semiconductor companies with 2006 sales of $6.4 billion (USD). www.freescale.com

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