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BusinessWire
July 17, 2007 05:00 AM Pacific Daylight Time

Freescale Experts Address Advanced Technologies and Application Trends at SEMICON West Conference

Disruptive Packaging Technology Named Advanced Packaging Awards Finalist
SEMICON West 2007

AUSTIN, Texas--(BUSINESS WIRE)--Freescale Semiconductor will showcase magnetoresistive random access memory (MRAM) and micro-electro-mechanical systems (MEMS) technology innovations and discuss key issues around semiconductor outsourcing during sessions at SEMICON West 2007. The conference will be held at the Moscone Center in San Francisco, July 16-18. In addition, Advanced Packaging magazine has selected Freescale’s redistributed chip packaging (RCP) technology as a finalist for its 2007 awards to be announced during the conference.

Farah Tuten, Chandler Fab engineering manager for Freescale will be on the panel, “The Next Big Outsourcing Thing: Process Development and Modules,” discussing the technological and economic benefits that the industry gains from strategic outsourcing of single process module foundries and other operational segments. He will be joined by executives from SVTC, Entrepix, Innovion, Lam Research and Toppan Photomasks, as well as panel moderator, Tom Cheyney, editor-publisher, Chip Shots blog and senior contributing editor, Small Times.

Saied Tehrani, Freescale’s director of SMARTMOS and MRAM technology will participate in SEMICON West’s Device Scaling TechXPOT. He will discuss the differences and benefits of MRAM versus other semiconductor memory technologies and the integration of magnetic devices with CMOS. Freescale is the industry’s leader in MRAM technology. The company introduced the world’s first commercial 4-Mbit MRAM device last year and recently expanded this product line to include the industry’s first 4-Mbit MRAM device with an extended temperature range for industrial applications.

Freescale’s MEMS automotive sensor operations manager, Dave Monk, will present during the conference’s Emerging Technologies and Markets TechXPOT. His session will focus on integration trends in MEMS, specifically multiple sensors and embedded control at the component level. Freescale has been developing MEMS-based sensors for over 25 years and these devices have been embraced by every major market. MEMS-based sensors are pervasive in everything from inkjet cartridges to cell phones and are a crucial component in automotive electronics, medical equipment, portable electronics and computer peripherals.

Advanced Packaging magazine has selected Freescale’s RCP technology as a finalist for this year’s award competition. RCP is a disruptive technology that can lead the industry to deliver 30 percent smaller packaged semiconductor solutions versus traditional ball grid array technology. The exceptional flexibility of RCP makes it a virtually universal package technology that is applicable across a large number of applications and materials. Instituted in 2004, the Advanced Packaging Awards honor the products and technologies that have shaped the semiconductor industry over the past year. The winners of the 2007 Advanced Packaging Awards will be announced on Wednesday, July 18, 2007 during a ceremony at the Museum of Modern Art, San Francisco from 6:00 to 7:00 p.m.

SEMICON West is acclaimed as the premier global event for the micro- and nanoelectronics industry. For more information, visit http://semiconwest.semi.org/index.htm.

Freescale panels and technical presentations at SEMICON West:

Tuesday, July 17:

The Next Big Outsourcing Thing: Process Development and Modules, Panel Discussion, Farah Tuten, Freescale
10:40 a.m. - 11:00 a.m. PDT, Moscone Esplanade Hall

Advanced Processes and Materials for New Devices: Magnetoresistive RAM, presented by Saied Tehrani, Freescale
11:50 a.m. - 12:10 p.m. PDT, North Hall

Wednesday, July 18:

MEMS Applications and Business Models: Integration Trends in MEMS, presented by David Monk, Freescale
3:20 p.m. - 3:40 p.m. PDT, West Hall, Level 2

About Freescale Semiconductor

Freescale Semiconductor is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial, networking and wireless markets. The privately held company is based in Austin, Texas, and has design, research and development, manufacturing or sales operations in more than 30 countries. Freescale is one of the world's largest semiconductor companies with 2006 sales of $6.4 billion (USD). www.freescale.com

 



 

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