Freescale Presents Latest Technology Advancements at Premier Industry Conferences

Papers Highlight Advanced Semiconductor Packaging and Process Technologies
57th Annual Electronic Components and Technology Conference
IEEE Interconnect Technology Conference

AUSTIN, Texas--(BUSINESS WIRE)--Freescale Semiconductor will present several technology papers at two key industry events. The 57th annual Electronic Components and Technology Conference (ECTC) will be held in Reno, Nevada, May 29 - June 1, 2007. The 10th annual IEEE Interconnect Technology Conference (IITC), sponsored by the IEEE Electron Devices Society, will be held in San Francisco, June 4 - 6, 2007. - At the two events, Freescale will present or co-present a total of 10 papers that highlight its recent research and development findings in redistributed chip packaging and process technology around high-K and the use of 3D technologies.

ECTC is acclaimed as the premier international packaging, components and microelectronic systems technology conference, striving to offer attendees an outstanding array of packaging technology information. Freescale’s technical papers cover leading-edge developments in advanced packaging, modeling and simulation, interconnections, materials and processing, quality & reliability and RF. For more information, visit http://www.ectc.net/.

The following is a list of papers Freescale plans to present at ECTC:

* The Redistributed Chip Package: A Breakthrough for Advanced Packaging
* High Performance RF MEMS Series Contact Switch – Design and Simulations
* 3D Multi Scale Modeling of Wire Bonding Induced Peeling in Cu/Low-K Interconnects: Application of an Energy Based Criteria and Correlations with Experiments
* Current Carrying Capability of Sn0.7Cu Solder Bumps in Flip Chip Modules for High Power Applications
* Challenge of the Temperature Cycling Test for Enhanced Packages with Low-K/Cu Devices

A premier conference for interconnect technology, IITC provides a forum for professionals in semiconductor processing, academia and equipment development to present and discuss exciting new science and technology through oral presentations, poster displays, exhibit booths and supplier seminars. Freescale plans to present five papers including progress around using 3D technologies. For more information, visit http://www.his.com/~iitc/info.html.

The following is a list of papers Freescale plans to present or co-present at IITC:

* Technology and Design Cooperation: High-K MIM Capacitors for Microprocessor, IO, and Clocking
* Progress of 3D-Integration Technologies and 3D Interconnects
* Full Copper Electrochemical Mechanical Planarization (Ecmp) as a Technology Enabler for the 45 and 32-nm Nodes
* Three Dimensional Chip Stacking using a Wafer-to-Wafer Integration
* Robust Integration of an ULK SiOCH dielectric (k=2.3) for high performance 32nm node

About Freescale Semiconductor

Freescale Semiconductor is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial, networking and wireless markets. The privately held company is based in Austin, Texas, and has design, research and development, manufacturing or sales operations in more than 30 countries. Freescale is one of the world's largest semiconductor companies with 2006 sales of $6.4 billion (USD). www.freescale.com

Freescale Technology Forum

The Freescale Technology Forum (FTF) has become the developer event of the year for the embedded semiconductor industry. The Forum, which debuted in 2005, has been enthusiastically received by the global developer community, drawing more than 12,000 attendees at FTF events worldwide since its inception. For more information about FTF events, please go to www.freescale.com/ftf.