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| Source: Lattice Semiconductor Lattice Will Feature Award Winning LatticeECP2M FPGA Family, PCI Express Solutions At Embedded WorldHILLSBORO, OR -- February 6, 2007 -- (Lattice Semiconductor (NASDAQ: LSCC) today announced it will demonstrate programmable PCI Express design solutions using its LatticeECP2M( FPGA development board at the Embedded World Conference and Exhibition, February 13-15, in Nürnberg, Germany. The LatticeECP2M board was tested at the October 2006 PCI-SIG compliance workshop and was demonstrated to be fully PIC Express v.1.0a specification compliant. The Lattice exhibit is located in Hall 12, Stand 674. The LatticeECP2M FPGA family has been named "Product of the Year" by Electronic Products magazine: it is the only low-cost FPGA family to offer both DSP functionality and SERDES I/O, as well as a host of features and performance that are unprecedented in a low-cost device. About LatticeECP2M FPGAs A flexible PCS layer that includes 8b/10b encoding, an Ethernet link state machine and rate matching circuitry also are built onto the chip. The SERDES/PCS combination is designed to support today's most common packet-based protocols, including PCI Express, Gigabit Ethernet, Serial RapidIO and wireless interface standards (OBSAI and CPRI). About Lattice Semiconductor Lattice continues to deliver "More of the Best" to its customers with comprehensive solutions for system design, including an unequaled portfolio of high-performance, non-volatile and low-cost FPGAs. Lattice products are sold worldwide through an extensive network of independent sales representatives and distributors, primarily to OEM customers in communications, computing, industrial, consumer, automotive, medical and military end markets. For more information, visit http://www.latticesemi.com Statements in this news release looking forward in time are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Investors are cautioned that forward-looking statements involve risks and uncertainties including market acceptance and demand for our new products, our dependencies on our third party silicon suppliers, the impact of competitive products and pricing, technological and product development risks and other risk factors detailed in the Company's Securities and Exchange Commission filings. Actual results may differ materially from forward-looking statements. Lattice Semiconductor Corporation, Lattice (& design), L (& design), LatticeECP2, LatticeECP2M and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.
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