Sigma Launches First UWB Wireless Chipset With Range-Extending Intelligent Array Radio™ Technology

New Windeo™ Chipset Represents the World’s First All-CMOS Ultra-Wideband Solution with Multiple Integrated Radios for Range Extension

CEATEC JAPAN 2006
MILPITAS, Calif. & TOKYO--(BUSINESS WIRE)--Sigma Designs (Nasdaq:SIGM), a leader in digital media processing for consumer electronics, today announced their WindeoTM Ultra-Wideband (UWB) chipset. The Windeo™ Chipset, along with Sigma’s media processors, offer the world’s first total solution for high speed wireless A/V streaming aimed at replacing HDMI cable and other Audio/Video cabling for digital home entertainment equipment. The Windeo™ chipset and total solution evaluation board are being showcased starting today at the Combined Exhibition of Advanced Technologies (CEATEC) show in Japan.

“The Windeo™ Chipset with our patent-pending Intelligent Array Radio™ technology can deliver, with superior quality, multiple audio/video streams to digital entertainment systems over highly reliable wireless connections,” said Hung Nguyen, Vice President and General Manager of the Wireless Products Division at Sigma Designs, Inc. “We are successfully demonstrating high definition video streaming that is uninhibited by walls, objects or people. It also allows customers to mount their TVs on walls and not have to worry about running the HDMI or analog cables across the room.”

“We are excited to offer customers a versatile and total solution with Sigma’s popular media processor chips including reference designs and software so that they can achieve fast time-to-market,” Nguyen added.

While WiFi (802.11) solutions have largely satisfied the need for medium bandwidth data communications, the latest challenge is to address the needs of in-home audio/video entertainment connectivity with the right bandwidth and affordability to handle high-definition video streams. Ultra-Wideband (UWB) technology offers an ideal solution, supporting a maximum data rate of 480 Mbps with high QoS, low power consumption and mainstream consumer pricing.

Sigma’s WindeoTM all-CMOS chipset is comprised of two devices: the WindeoTM RF IC (B7CW101) and the WindeoTM Baseband IC (B7CW201) with an integrated PHY, MAC and embedded 32-bit RISC core -- both of which are based on the WiMedia Alliance MAC & PHY specifications. The WindeoTM Chipset provides high performance wireless data rates using three bands, centered at 3.43 GHz, 3.96 GHz, and 4.48 GHz, with a spectrum spread of 528 MHz each.

Sigma’s patent-pending Intelligent Array Radio™ (IAR) technology extends coverage range while maximizing wireless link reliability and minimizing undesirable interference. IAR technology involves utilizing multiple receive radios to process multi-channel signals which are then subjected to adaptive algorithm that optimizes both amplitude and phase under various channel environments.

Under the current implementation, the WindeoTM RF IC integrates 3 receive radios along with 1 transmit radio and the capability to support a 3-antenna array, establishing a high performance physical layer link. Then, the WindeoTM Baseband IC processes the 3 channels simultaneously and adaptively using the IAR algorithms on wide band signals. A major advantage of the IAR approach is to remain fully compatible with the WiMedia standard and relevant FCC requirements while enhancing basic performance.

The WindeoTM RF IC is packaged in a small footprint 92-pin leadless Bump Chip Carrier (BCC) and supports data rates up to 480 Mbps. The WindeoTM Baseband is packaged in a 304-pin TFPGA. Besides the ability to support both WiMedia framing formats, DRP and PCA, the Windeo™ Baseband also supports several interfaces including PCI, mini-PCI, DVB-SPI and several local buses. The Windeo™ chipset interfaces are fully compatible with all Sigma’s media processors including device driver and applications software.

The Windeo™ chipset engineering samples and the Evaluation Kit with the EM8622L media processor are available now for ordering. Initial production availability is planned for December of this year.