HOME :: JOB LISTINGS :: ARCHIVES :: MEDIA KIT :: SUBSCRIBE


BusinessWire
June 20, 2006 06:00 AM US Pacific Timezone

ATI Implements Mentor Graphics Modular TestKompress for Production Test of Advanced 90nm Graphics Processor

WILSONVILLE, Ore.--(BUSINESS WIRE)--June 20, 2006--Mentor Graphics Corporation (Nasdaq:MENT) today announced that ATI Technologies Inc. has implemented the Mentor Graphics TestKompress(R) embedded deterministic test (EDT(TM)) tool. ATI used Modular TestKompress, a new block-level implementation of Mentor's EDT methodology that improves compression performance and routing on large, complex devices. Using the new Modular TestKompress, ATI achieved significant compression of test time and test data volume.

"Working closely with Mentor Graphics, we were able to use the TestKompress product to thoroughly test our new chip at no additional test cost," said Michael Do, design for test (DFT) architect, ATI Technologies Inc. "Mentor Graphics continues to deliver value-enhancing products."

With device complexity growing and process technologies shrinking, achieving cost-effective high test quality has become increasingly difficult. Test sizes have grown to keep up with design sizes, and nanometer processes have created new challenges, requiring more tests to detect them. The Modular TestKompress tool implements an embedded compression scheme at the block level that dramatically reduces the size of the test sets required for today's complex designs, enabling comprehensive test coverage without sacrificing test throughput. Modular TestKompress provides designers with a block-based flow whereby each block, along with associated compression logic, can be implemented and verified independently. This simplifies the design flow for large block-based designs and reduces the routing area needed to connect the compression hardware.

"ATI is at the forefront of device complexity. Working together, Mentor Graphics adapted the proven TestKompress tool to create a new manufacturing test methodology that solves ATI's test challenges," said Robert Hum, vice president and general manager of the Design Verification and Test division for Mentor Graphics. "This successful implementation of Modular TestKompress highlights Mentor's ability to help its customers achieve higher test quality and lower test cost, even for the most advanced devices and process geometries."

The TestKompress tool fits easily into most scan-based design flows and offers the same at-speed test capabilities as Mentor Graphics FastScan(TM), the industry-leading automatic test pattern generation (ATPG) tool. The TestKompress tool's patented compression capabilities reduce the amount of test data required for the detection of the speed-related defects that are more prevalent at nanometer process technologies.

About Mentor Graphics Design-for-Test Tools

Mentor Graphics provides the industry's broadest portfolio of DFT solutions for today's System-on-Chip and deep submicron designs, including integrated solutions for scan, ATPG, EDT, advanced memory test, boundary scan, logic built-in self-test and a variety of DFT-related flows. For more information, visit www.mentor.com/products/dft.

About Mentor Graphics

Mentor Graphics Corporation (Nasdaq:MENT) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronics and semiconductor companies. Established in 1981, the company reported revenues over the last 12 months of over $700 million and employs approximately 4,000 people worldwide. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. World Wide Web site: http://www.mentor.com/.

Mentor Graphics and TestKompress are registered trademarks and FastScan is a trademark of Mentor Graphics Corporation. All other company or product names are the registered trademarks or trademarks of their respective owners.


 

All material on this site copyright © 2006 techfocus media, inc. All rights reserved.
Embedded Technology Journal
Privacy Statement